题 目：Fan-Out Wafer-Level Packaging and 2.5D/3D IC Integration

报告人：John H Lau

时 间：2017年1月14日（本周六） 上午9点

地 点：皇冠新体育app报告厅

欢迎广大师生踊跃参加！

BRIEF BIO

With more than 37 years of R&D and manufacturing experience in semiconductor packaging, John has published more than 440 peer-reviewed papers, 30 issued and pending patents, and 18 textbooks on, e.g., Advanced MEMS Packaging (McGraw-Hill Book Company, 2010), Reliability of RoHS compliant 2D and 3D IC Interconnects (McGraw-Hill Book Company, 2011), TSV for 3D Integration, (McGraw-Hill Book Company, 2013), and 3D IC Integration and Packaging (McGraw-Hill Book Company, 2016). John is an elected ASME Fellow and has been an IEEE Fellow since 1994.