报告题目：系统集成的微纳米技术（Micro/Nano-technologies forMicrosystem

Integration）

报告人：YC LEE（科罗拉多大学Boulder分校机械工程Chair教授）

报告时间：2015年10月26日（星期一）15:00-16:30

报告地点：动力与机械学学术报告厅（新九教三楼）

报告摘要：Micro/nano-technologies are critical to microsystem integration. Current micro-scaled technologies used in manufacturing can be enhanced substantially by using nano-technologies. Interestingly, some nano-technologies can only be realized effectively by using novel micro-technologies. Atomic layer deposition (ALD) and molecular layer deposition (MLD) will be reviewed to illustrate how to enhance micro-technologies for the development offlexible thermal ground planes(TGPs). Such TGPs withthicknesses down to 200µm and effective thermal conductivities higher than 2,000 W/mKare essential to control skin temperatures of very thin smartphones and wearable electronics. As for the nano-technologies enhanced by micro-technologies, a good example is our study on the use of a microfluidic device to form membrane protein polyhedral nanoparticles (MPPNs). Membrane proteins are critical to pharmaceutical therapies, constituting the targets of more than 50% of currently approved drugs. However, it is very expensive to determine the structure of a membrane protein using MPPNs. With the microfluidic device, we can reduce time from days to seconds and proteins from 100 µg to 100 ng for each evaluation run during the process to identify the optimum conditions to form MPPNs.

作者简介：Dr. Y. C. Lee is the S. J. Archuleta Professor at the Department of Mechanical Engineering, University of Colorado Boulder (CU-Boulder). From 2006 to 2012, he served as the Director of the DARPA Center for Integrated Micro/Nano-Electromechanical Transducers (iMINT) hosted by CU-Boulder. From 1993 to 2002, he served as an Associate Director of the National Science Foundation (NSF) Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics (CAMPmode), CU-Boulder. Prior to joining the University in 1989, he was a Member of Technical Staff at AT&T Bell Laboratories, Murray Hill, New Jersey. Dr. Lee is recognized for his research contributions in packaging and interconnect for microsystems integrating microelectronic, optoelectronic, microwave, and microelectromechanical and nanoelectromechanical devices. He is the Editor of ASME Journal of Electronic Packaging. He has received the following awards/honors:1) ASME InterPACK Achievement Award, 2013; 2) ASME Electronic and Photonic Packaging Division’s Mechanics Award, 2007; 3)ASME Fellow, 2002; 4)Presidential Young Investigator Award, NSF, 1990; and 5) Outstanding Young Manufacturing Engineer Award, SME, 1992.