Venue

Time

Topic

Speaker

Room E（晴川厅）

8:30--10:30

PDC-1

It is Time for Low Temperature - Low Temperature Solders , New Development, and Their Applications

Dr. Ning-Cheng Lee, Indium, USA

10:30--12:30

PDC-3

Fan-Out Wafer/Panel-Level Packaging and 3D Packaging

Dr. John H Lau, ASM, HK

Room F（琴台厅）

8:30--10:30

PDC-2

Hygrothermomechanical Reliability of IC Packages

Prof. Andrew Tay, NUT,Singapore

10:30--12:30

PDC-4

Modeling and Simulation for Analog and Power Electronic Packaging

Dr. Yong Liu, Fairchild, USA